2009 Microchip Technology Inc.
DS39636D-page 219
PIC18F2X1X/4X1X
18.2
Selecting and Configuring
Acquisition Time
The ADCON2 register allows the user to select an
acquisition time that occurs each time the GO/DONE
bit is set. It also gives users the option to use an
automatically determined acquisition time.
Acquisition time may be set with the ACQT2:ACQT0
bits (ADCON2<5:3>), which provides a range of 2 to
20 TAD. When the GO/DONE bit is set, the A/D module
continues to sample the input for the selected acquisi-
tion time, then automatically begins a conversion.
Since the acquisition time is programmed, there may
be no need to wait for an acquisition time between
selecting a channel and setting the GO/DONE bit.
Manual
acquisition
is
selected
when
ACQT2:ACQT0 = 000. When the GO/DONE bit is set,
sampling is stopped and a conversion begins. The user
is responsible for ensuring the required acquisition time
has passed between selecting the desired input channel
and setting the GO/DONE bit. This option is also the
default Reset state of the ACQT2:ACQT0 bits and is
compatible with devices that do not offer programmable
acquisition times.
In either case, when the conversion is completed, the
GO/DONE bit is cleared, the ADIF flag is set and the
A/D begins sampling the currently selected channel
again. If an acquisition time is programmed, there is
nothing to indicate if the acquisition time has ended or
if the conversion has begun.
18.3
Selecting the A/D Conversion
Clock
The A/D conversion time per bit is defined as TAD. The
A/D conversion requires 11 TAD per 10-bit conversion.
The source of the A/D conversion clock is software
selectable. There are seven possible options for TAD:
2 TOSC
4 TOSC
8 TOSC
16 TOSC
32 TOSC
64 TOSC
Internal RC Oscillator
For correct A/D conversions, the A/D conversion clock
(TAD) must be as short as possible, but greater than the
minimum
TAD
(see
parameter
for
more
information).
Table 18-1 shows the resultant TAD times derived from
the device operating frequencies and the A/D clock
source selected.
TABLE 18-1:
TAD vs. DEVICE OPERATING FREQUENCIES
AD Clock Source (TAD)
Maximum Device Frequency
Operation
ADCS2:ADCS0
PIC18FXXXX
PIC18LFXXXX(4)
2 TOSC
000
2.86 MHz
1.43 kHz
4 TOSC
100
5.71 MHz
2.86 MHz
8 TOSC
001
11.43 MHz
5.72 MHz
16 TOSC
101
22.86 MHz
11.43 MHz
32 TOSC
010
40.0 MHz
22.86 MHz
64 TOSC
110
40.0 MHz
22.86 MHz
RC(3)
x11
1.00 MHz(1)
1.00 MHz(2)
Note 1:
The RC source has a typical TAD time of 0.9
μs.
2:
The RC source has a typical TAD time of 1.2
μs.
3:
For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D
accuracy may be out of specification.
4:
Low-power (PIC18LFXXXX) devices only.
相关PDF资料
PIC18F86K22-I/PTRSL MCU PIC 64K FLASH XLP 80TQFP
PIC16C63A-04I/SP IC MCU OTP 4KX14 PWM 28DIP
PIC16C63A-04I/SO IC MCU OTP 4KX14 PWM 28SOIC
52559-2270 CONN FFC 22POS .5MM VERT ZIF SMD
52559-1870 CONN FFC 18POS .5MM VERT ZIF SMD
DSPIC33EP64MC506-I/PT IC DSC 16BIT 64KB FLASH 64TQFP
52745-1896 CONN FFC 18POS .5MM R/A ZIF SMD
PIC16LC622-04/P IC MCU OTP 2KX14 COMP 18DIP
相关代理商/技术参数
PIC16F737-I/SP 制造商:Microchip Technology Inc 功能描述:IC 8BIT FLASH MCU 16F737 SDIL28
PIC16F737-I/SS 功能描述:8位微控制器 -MCU 7KB 368 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F737T-I/ML 功能描述:8位微控制器 -MCU 7KB 368 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F737T-I/SO 功能描述:8位微控制器 -MCU 7KB 368 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F737T-I/SS 功能描述:8位微控制器 -MCU 7KB 368 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F73-E/ML 功能描述:8位微控制器 -MCU 7 KB 368 RAM 25I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F73-E/SO 功能描述:8位微控制器 -MCU 7KB 192 RAM 22 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F73-E/SP 功能描述:8位微控制器 -MCU 7KB 192 RAM 22 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT